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Senior/Staff/Sr. Staff Packaging Engineer

Exo

Exo

Taiwan
Posted on Friday, December 15, 2023

We are taking medical imaging where you never thought it could go - everywhere. We're aiming to build a future healthcare system that's unconstrained by the four walls of a hospital and engineered for a world where providers can see into every patient immediately. We are building an affordable handheld ultrasound device and workflow platform for a new era of medical care.

Job Summary:

Exo Imaging is seeking a senior member of technical staff to develop, test, debug packaging & assembly process and improve manufacturing processes/yield in close partnership with internal engineering team and external suppliers. You will be working as a team member with packaging team in both headquarter and subcontractor to manage overall packaging platform including process yield analysis and improvement, new process, technology and product introduction, OSAT management for our multimillion revenue products.

Job Responsibilities (but not limited to):

  • Work with internal cross functional team and external partners to design and develop the packaging process and improve the yield for high volume production.
  • Process troubleshooting, failure analysis, and correction actions implementation.
  • Ability to function effectively as part of a team, while also being able to work independently.

Education/Experience Requirements:

  • BS degree/MS degree with a minimum of 7 years of experience in IC packaging design, process development and having experience in a high-volume manufacturing environment. Medical or MEMS device development experience is highly desirable.
  • 5+ years hands-on experience in package design and development, packaging & assembly test / debug, process development, integration, verification and optimization of devices (consumer, medical, industrial, aerospace & defense, etc.)
  • 5+ years of experience working with manufacturing supply chain including providers of materials, tools and contract manufacturing.
  • Extensive experience in wafer dicing, thermal compression bond, die attach, wirebond, liquid molding, laser singulation, PCB SMT assembly and PCB manufacturing process.
  • Experience in wafer-level-packaging processes such as wafer thinning, thin wafer handling, temporary bond / debond and TSV.
  • Knowledge in MEMS processes such as deep Si etch with DRIE and backside wafer lithography.
  • Extensive experience in socket test of functional packages and QC techniques such as warpage measurement, wirebond pull / shear, solder bond strength test, die shear, X-ray, IR imaging, C-SAM (SAT).
  • Sharp critical-thinking aptitude and strong problem-solving skills with methodical, analytical and statistical approaches.
  • Thorough understanding of key criteria in manufacturing processes such as manufacturability, yield, reliability, quality control and cost structure
  • Demonstrated ability to deliver high quality results in fast-paced projects.
  • Strong written, verbal communication and presentation skills.

Other Requirements (Travel, etc.):

  • 15-25% travel to US headquarter and suppliers in worldwide (mainly in Asia)
  • Proven ability to build and inspire engineering teams in a high paced environment. Cross functional management experience is required.
  • Fluent speaking of Chinese and English is a plus.

Like what you see? Apply and join our team! We recently secured $220M in our Series C funding round and we're rapidly growing our team.